XP8® QCM
XP8 QCM is a PEALD tool focused on advanced node memory and logic applications. It is capable of a broad range of dielectric PEALD processes, including silicon oxide and silicon nitride.
Major features
XP8 QCM is a 300mm tool for high-productivity plasma enhanced atomic layer deposition (PEALD) for advanced node memory and logic applications. The QCM, or Quad Chamber Module, is a process module with four tightly integrated process reactors.
Up to four QCM modules can be configured to each XP8 platform, enabling processing of up to 16 wafers at a time in high-volume production within a compact footprint. The system is capable of a broad range of dielectric PEALD processes, including silicon oxide and silicon nitride.
XP8 QCM PEALD benefits
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Independent chambers for optimum performance;
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Low volume chamber for efficient gas use and fast processing;
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Excellent chamber-to-chamber matching for wafer-to-wafer repeatability;
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Low cost of ownership;
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Easy opening chamber design for fast maintenance;
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Efficient energy consumption.
Major applications
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Broad conformal film portfolio for liners, spacers, etch stop layers;
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Low temperature conformal film portfolio for Spacer Defined Multiple Patterning;
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High aspect ratio gap-fill