XP8® QCM

XP8 QCM is a PEALD tool focused on advanced node memory and logic applications. It is capable of a broad range of dielectric PEALD processes, including silicon oxide and silicon nitride.

High productivity, compact footprint.

Major features

XP8 QCM is a 300mm tool for high-productivity plasma enhanced atomic layer deposition (PEALD) for advanced node memory and logic applications. The QCM, or Quad Chamber Module, is a process module with four tightly integrated process reactors. 

Up to four QCM modules can be configured to each XP8 platform, enabling processing of up to 16 wafers at a time in high-volume production within a compact footprint. The system is capable of a broad range of dielectric PEALD processes, including silicon oxide and silicon nitride. 

 

XP8 QCM PEALD benefits 

  • Independent chambers for optimum performance;  

  • Low volume chamber for efficient gas use and fast processing;  

  • Excellent chamber-to-chamber matching for wafer-to-wafer repeatability;  

  • Low cost of ownership; 

  • Easy opening chamber design for fast maintenance;  

  • Efficient energy consumption. 

 

Major applications 

  • Broad conformal film portfolio for liners, spacers, etch stop layers;  

  • Low temperature conformal film portfolio for Spacer Defined Multiple Patterning;  

  • High aspect ratio gap-fill 

 

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